lapping machines

Model 910 - Lapping and Polishing Machine

This model 910 is specially designed to provide all of the features required to obtain outstanding results using the EMS Polisher. The Polisher is designed for SEM cross sectioning and also for TEM wedge polishing preparation. For instance, TEM wedge polishing requires that the polishing wheel rotates at a constant speed with high torque at a very low rpm.

This combination of features is not found in standard grinders. Our model 910 provides all of the requirements that a Tripod Polisher needs. This includes the use of diamond lapping films and either colloidal silica or colloidal alumina suspensions. Plain backed diamond lapping film adhered to a glass plate by surface tension, and is easily removed for storage and re-use. Model 910 is also designed for ease of cleaning and disposal of abrasive debris.

Features

Specifications:

Dimensions:	21” x 13” x 11”
Net weight:	60 lb (27kg)
Motor:	1/20 HP
Wheel Diameter:	8”
Electrical:	90-120VAC; 5-/60Hz or 200-240 VAC, 50/60Hz

Model 910 includes:

Water and slurry delivery system, Aluminum lapping plate (includes O-ring #50122-30 for metal holding band), Metal holding band (for holding abrasive papers and polishing cloth, #50122-31), Glass plate, Dust cover, Hex wrench set

Lapping and Polishing Fixtures

The Electron Microscopy Sciences Precision Lapping and Polishing Fixtures are designed to accurately produce polished parallel, tapered or critically oriented samples with minimal sub-surface damage. A series of specialized fixtures has been developed for lapping and polishing samples up to 6" in diameter, TEM samples and oriented crystals. In addition to size and shape, the fixtures differ in the type of thickness control techniques they employ. The Lapping and Polishing Fixtures are designed to be used either by hand or with a lapping machine (Model 920 above). Sample Mounting Fixtures are also designed to be used in conjunction with these fixtures to ensure that the sample is mounted parallel to the mounting block and that a thin, uniform layer of wax exists between the mounting block and the sample.

Micrometer Controlled Fixtures

The micrometer method of thickness control employs a dial with 25 micron or finer graduations, that is adjusted relative to the outside support ring to set the amount of material to be removed. To set the dial, the sample is initially zeroed against the lapping plate and then the dial is adjusted to create a gap between the outside support ring and the center slide. This gap corresponds to the amount of material to be removed and gradually decreases, as the sample is lapped or polished, until the final thickness is reached. The load on the sample is varied by adding weights or finger pressure to the top of the fixture. Due to the ease of adjustment, a micrometer controlled fixture is generally used when desired sample thickness will vary from sample to sample.

Features:

• Tungsten carbide base resists wear and maintains sample planarity.

• Wide base ensures stability thereby minimizing sample damage and edge rounding.

• Wear ring is replaceable on some fixtures, which extends the life of the fixture.

• Can be mounted in the Model 920 Lapping & Polishing Machine for semi-automatic processing.

• Micrometer depth control allows precise control over sample thickness.

• Precisely crafted stainless steel construction ensures long life and high precision.

Sample Mounting Fixtures

The proper mounting of samples is a critical step in the lapping and polishing process. It is imperative that the sample is firmly mounted parallel to the sample mount surface the ensure accurate results. Typically, samples are mounted using a low melting point wax (such as EMS #50400-01). Sample Mounting Fixtures are designed to both monitor the temperature of the wax and to provide a uniform mounting pressure.

Operation:

When using low melting point wax, the mounting block is first heated on a hot plate then a thin layer of wax is melted evenly on it. The sample is placed on the mounting block, an appropriate size pressure plate is placed on the sample and they are placed together on the base of the mounting fixture. A Spring-loaded rod is then positioned in the center of an indent in the pressure plate while setting the pressure with the height adjustment of the arm. The whole assembly is then placed on a hot plate until the correct temperature is reached and maintained for a short while to ensure a uniform layer of wax cooling tray to facilitate the hardening of the wax.

Model 180 Stackable Lapping Trays Hand Lapping Tray

This model consists of a replaceable 12" square glass lapping plate mounted into a cast aluminum tray. The tray is designed to serve as a secure surface for the glass plate while polishing with abrasive slurries, abrasive paper or abrasive films. The area under the glass plate acts as a reservoir to contain the used 

Model 160 Chemical Polishing Fixture

The polishing of semiconductor materials often requires the use of harsh chemicals such as bromine or hydrofluoric acid solutions that would corrode the stainless steel from which most of the EMS fixtures are constructed. A special fixture for satisfying this requirement has been developed. The Model 160 is made of PTFE and is designed to hold crystal wafers pt o 2 1/8" diameter while they are being polished with very corrosive chemicals. The sample is held in place by vacuum and the sample is polished by rubbing the exposed sample against a suitable polishing cloth soaked with the chemical solution. The Model 160 is ideal for damage free polishing of semiconductor materials with harsh chemicals and has been used extensively for polishing GaAs with bromine-methanol solutions.

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